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Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications

Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications

0.5mm Thickness Flexible PCB Assembly

0.5OZ-5OZ Copper Flexible Printed Circuit Board

High Power Output FPC Assembly

Lugar de origem:

China ou Camboja

Marca:

Suntek/BLSuntek

Certificação:

ISO9001 ISO13485 IATF16949 UL

Número do modelo:

FPC1024

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Detalhes do produto
Superfície:
HASL, ENIG, OSP, Revestimento duro, estanho de imersão
Material:
Pi
Grossura:
0,5 mm
Cor da máscara de solda:
AMARELO
Inspeção de raios-X:
Para BGA,OFN,QFP com almofadas de fundo
Cobre:
0.5oz-5oz
COMPATIBILIDADE:
Universal
Saída de energia:
Alto
Conformidade do produto:
Rohs
Camada:
lado duplo
Termos de pagamento e envio
Quantidade de ordem mínima
Não limitado
Preço
Customized products
Detalhes da embalagem
Por bolsas ESD e caixa
Tempo de entrega
5-7 dias depois de todos os componentes preparados
Termos de pagamento
T/T.
Descrição do produto
Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications
Suntek Contract Factory

Suntek Group is a leading supplier in EMS field with one-stop solution for:

  • PCB/FPC assembly
  • Cable assembly
  • Mix technology assembly
  • Box-buildings

Suntek Electronics Co., Ltd, as the major facility, located in Hunan Prov, China; BLSuntek Electronics Co., Ltd, as the new facility, located in Kandal Prov, Cambodia.


Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications 0

Capabilities Overview
Layers Rigid PCB 2 - 40 + Layers, Rigid-flex PCB 1 - 10 Layers
Panel Size (max) 21" x 24"
PCB Thickness 0.016" to 0.120"
Line & Spaces 0.003" / 0.003" Inner Layers; 0.004" Outer Layers
Hole Size 0.006" Thru Hole (Finished Size) and 0.004" Buried Via
Materials FR4, High Tg, Rogers, Halogen-free material, Teflon, Polyimide
Surface Finishes ENi/IAu, OSP, Lead-free HASL, Immersion Gold/Silver, Immersion Tin
Special Products Blind/Buried Via (HDI 2+N+2), Rigid Flex

Application
Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications 1

Packing and Shipping

Packaging: Our Flexible PCB Assembly products are securely packaged in sturdy cardboard boxes with bubble wrap protection. Each box is clearly labeled with product details and handling instructions.

Shipping: We use reliable courier services with package tracking and insurance. Customers receive tracking numbers and must sign upon delivery confirmation.


Our Services
  • PCB/FPC fabrication
  • Components sourcing
  • PCB/FPC assembly
  • Custom cable/harness assembly
  • Box build


Additional services include:

  • SMT, THT, BGA, 0201 Chips assembly
  • AOI, X-Ray, ICT, FT, Burn-in testing
  • Conformal coating or gluing
  • High-mix, small to medium volume production


Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications 2

Our Advantages
  • Quick response: Fast turnaround times for prototypes and production
  • Cost-effective: Competitive pricing without compromising quality
  • One-stop service: Comprehensive solutions from components to final assembly
  • Reliability: 1-year warranty on all products
  • Confidentiality: Strict IP protection throughout the process
  • Flexibility: Accommodates prototypes to production volumes

What Suntek Can Offer
  1. PCB and FPC bare board manufacturing
  2. PCB and FPC assembly services
  3. Components purchasing and materials customization
  4. Turnkey box build assembly solutions
  5. Mixed technology assembly
  6. Cable assembly and wire harness production
  7. Low/mid/high volume PCB assembly
  8. BGA/QFN/DFN with X-ray inspection
  9. IC programming and comprehensive testing services

Our Factory
Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications 3 Flexible PCB Assembly with 0.5mm Thickness and 0.5OZ-5OZ Copper for High Power Output Applications 4

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